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8 "oxidation LPCVD furnace (small batch)

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Performance：

 ◆Vertical structure, efficient production capacity, 50 pieces/batch

 ◆Stable and excellent film-forming uniformity, with good repeatability

 ◆Advanced Technology for Low Oxygen Control in Microenvironments

 ◆Stable control of silicon wafer particle size, international standard;

 ◆Fully automated process, box to box, 6-box storage

 ◆High integration, complete factory MES system integration

 ◆Complies with standards such as SECS II/HSMS/GEM

 Supporting technology:

 ◆Oxidize：Dry oxygen/wet oxygen （DCE, HCL） 

 ◆Nitrogen and hydrogen annealing (rapid thermal annealing), sintering, alloying, curing, etc

◆LPCVD Technology：Polycrystalline silicon, silicon nitride, silicon oxide (PSG, BPSG, etc.), TEOS, HTO/LTO, SIPOS, etc.


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